CBS075S-P0812 is chemically coated PI film which is widely used in the application which needs heat resistance and balanced properties in MD/TD… …>>
Laser processing particles (debris) generated during the ablation process cannot be removed by deionized water cleaning once attached to the wafer surface. Debris causes device defects such as bonding defects and increased current leaks… …>>
OCA는 터치스크린패널(TSP)의 각 레이어(Layer) 또는 커버글라스와 디스플레이를 합지하기 위해 사용되는 광학적으로 투명한 점착필름입니다 … …>>
